Wenchao Tian and Haoyue Ji Pages 102 - 111 ( 10 )
Wire bonding is still the dominant form of electronic packaging for its mature technology, low cost and high reliability. The development trend of electronic components is: small volume, high power, high frequency and high reliability. With the improvement of signal transmission frequency and device power, bonding wire cannot be regarded as simple transmission line with no loss. In this paper, the latest research status and various patents of wire bonding electromagnetic characteristics are summarized in three aspects: bonding wire, wire layout and packaging structure. The factors affecting the electromagnetic characteristics are summarized and several resolutions are proposed to improve the electrical properties. In the meantime, the prospect and development trends are described in this paper. With the study of bonding wire loop technology and electromagnetic properties, the wire bonding form can continue to meet the requirements of encapsulation process and be dominant solution of low cost encapsulation in a long time.
Crosstalk, electrical connection, electromagnetic characteristics, electronic packaging, wire bonding, wire geometry.
School of Electro-Mechanical Engineering, Xidian University, No.2, TaiBai South Road, Xi'an, Shaanxi, 710071, P.R. China.